SAICAS EN type automatic slicing production option
A 10mg slice can be automatically produced in about 60 minutes! Introducing the SAICAS EN model exclusive option.
The "SAICAS EN Type Automatic Sectioning Option" utilizes the precise functions of the SAICAS device to automatically cut samples at a thickness of "um order" from the very surface of the specimen, producing sections. You can specify a thickness of 5 to 10 um for the surface layer of the sample to create sections and prepare analysis surfaces. An additional sample stage that adsorbs large area samples and an electric X-axis stage have been added, enabling faster cutting compared to conventional SAICAS devices. 【Features】 ■ Dedicated option for SAICAS EN type ■ Compatible with samples that are prone to tearing ■ Enables faster cutting than conventional SAICAS devices ■ Can automatically produce a 10 mg section in about 60 minutes ■ The produced sections can be utilized for analysis applications such as SEC *For more details, please refer to the PDF document or feel free to contact us.
- Company：ダイプラ・ウィンテス 本社
- Price：Other
